Silicone Thermal conductivity products
OCS materials
Silicon-based liquid heat-dissipating filler, heat-dissipating gap filler, heat-dissipating grease and heat-dissipating pad products
Product Description
1. Thermal Encapsulants
- Easy to use as a flowable product
- High permeability to work with narrow gaps
- Low viscosity applicable to a wide range of heating sites
- Heat dissipation through dust, moisture resistance, and fixed functions
2. Thermal grease
- Low application difficulty in semi-solid state
- No reaction and phase change, favorable for rework
- Excellent heat resistance, cold resistance
- Filling between the heat airflow heating element and the heat sink
3. Thermal gap filler
- Advantage over PAD when applied to structures and surfaces of various devices in liquid form
- Freely adjustable APPLICATION depending on the product's purpose and conditions
- Production efficiency is higher and elastic than PAD application, which is effective in mitigating impact
4. Thermal Pad
- It can be supplied in the form of a finished product and applied immediately
- No additional equipment required when applied to the production process
- Easy to attach and detach
- Mainly applied to a wide temperature range and low hardness
Other products from the company
Recommendation